| 发明名称 | Substrate structure, method of mounting semiconductor chip, and solid state relay | ||
| 摘要 | This invention provides a substrate structure that can effectively prevent scattering of solder balls which are produced due to explosion attributable to evaporation of flux during reflow soldering, and spreading of molten solder to the surroundings. On a substrate, a semiconductor chip is mounted via solder paste. The substrate is provided with a groove portion which continuously or discontinuously surrounds the solder paste. | ||
| 申请公布号 | US9245829(B2) | 申请公布日期 | 2016.01.26 |
| 申请号 | US201313949206 | 申请日期 | 2013.07.23 |
| 申请人 | OMRON Corporation | 发明人 | Hara Shintaro;Konagata Shoichi;Iwasaki Yuzo;Shiraishi Tomonori |
| 分类号 | H01L23/48;H01L23/492;H01L23/00;H05K1/11;H01L23/13;H05K3/34 | 主分类号 | H01L23/48 |
| 代理机构 | Klarquist Sparkman, LLP | 代理人 | Klarquist Sparkman, LLP |
| 主权项 | 1. A substrate structure comprising: a substrate; a groove portion formed in said substrate for surrounding an area to which a solder paste is applied, said solder paste for mounting a semiconductor device, wherein the groove portion is formed along an outer edge of the mounted semiconductor device when said semiconductor device is placed on the substrate and a portion of the groove portion is formed inside the outer edge of the semiconductor device when said semiconductor device is placed on the substrate, said groove portion being configured to retain molten solder to prevent the molten solder from spreading to an area outside a mounting area of the semiconductor device when the solder paste melts. | ||
| 地址 | Kyoto JP | ||