CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCER MODULE USING WIRE-BONDING

摘要

Disclosed is a capacitive micromachined ultrasonic transducer module (CMUT) using wire-bonding. The disclosed module comprises: a CMUT chip which has a plurality of first electrode pads on a first surface thereof; a flexible printed circuit which is arranged on a first surface of the CMUT chip and which has a plurality of first holes, which expose the plurality of first electrode pads, formed therein; a plurality of second electrode pads formed on the flexible printed circuit so as to correspond to the plurality of first electrode pads; and a plurality of wires which connect the first electrode pads of the CMUT chip to the second electrode pads of the flexible circuit board.