Passively controlled smart microjet cooling array

摘要

An impingement cooling system for cooling electronic components includes a nozzle array having a plurality of nozzles in fluid communication with a source of cooling fluid, each nozzle including a deflection structure that deforms above a threshold temperature. A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures and conduct heat from at least one of the electronic components to the deflection structures. When a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the electronic component. The deflection structure may be a deflection plate formed of a bimetallic material having layers of different thermal expansion coefficients, or a thermally responsive two-way shape memory material.

主权项

1. An impingement cooling system for cooling electronic components, the impingement cooling system comprising:
a nozzle array including a plurality of nozzles that are in fluid communication with a source of cooling fluid, each nozzle comprising at least one deflection structure that deforms above a threshold temperature; and a plurality of thermally conductive pins respectively in thermal contact with the deflection structures of the plurality of nozzles that conduct heat from at least one of the electronic components to the deflection structures of the nozzles; wherein when a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin to the deflection structure of the heated nozzle, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the at least one of the electronic components.