Ball grid array semiconductor package and method of manufacturing the same

摘要

A BGA semiconductor package includes a semiconductor device adhered by adhesive to a substrate, and a conductive micro ball fitted into a through-hole provided in the substrate. A bonding wire electrically connects the semiconductor device and the micro ball to each other. An encapsulation member made of resin encapsulates the semiconductor device, the adhesive, part of the micro ball, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted. At least a part of a bottom surface of the micro ball has an exposed portion as an external connection terminal, which is exposed through the through-hole provided in the substrate as a bottom surface of the encapsulation member.

主权项

1. A BGA semiconductor package, comprising:
a semiconductor device; a substrate on which the semiconductor device is mounted; an adhesive for adhering the semiconductor device and the substrate to each other; a micro ball having conductivity, the micro ball having a part fitted into a through-hole provided in the substrate; a bonding wire for electrically connecting the semiconductor device and the micro ball to each other; and an encapsulation member for encapsulating, with an encapsulation resin, the semiconductor device, the adhesive, a part of the micro ball which is not fitted into the through-hole, and the bonding wire, only on a surface side of the substrate on which the semiconductor device is mounted, at least a part of a bottom surface of the micro ball having an exposed portion as an external connection terminal, exposed through the through-hole provided in the substrate which forms a bottom surface of the encapsulation member.