发明名称 Method for manufacturing an interdigitated back contact solar cell
摘要 A method for manufacturing an interdigitated back contact solar cell, comprising steps of: (a) providing a doped silicon substrate; (b) doping the rear surface of the substrate homogeneously with boron in a blanket pattern, thereby forming a p+ region on the rear surface of the silicon substrate; (c) forming a silicon dioxide layer on the front and rear surface; (d) depositing a phosphorus-containing doping paste on the rear surface in a second pattern; (e) heating the silicon substrate to locally diffuse phosphorus into the rear surface of the silicon substrate, thereby forming an n+ region on the rear surface of the silicon substrate through the second pattern, wherein the p+ region and the n+ region on the rear surface collectively form an interdigitated pattern; and (f) removing the second silicon dioxide layer from the silicon substrate.
申请公布号 US9246029(B2) 申请公布日期 2016.01.26
申请号 US201514627350 申请日期 2015.02.20
申请人 E I DU PONT DE NEMOURS AND COMPANY 发明人 Scardera Giuseppe;Poplavskyy Dmitry;Inns Daniel Aneurin;Bendimerad Karim Lotfi;Dugan Shannon
分类号 H01L21/00;H01L31/0224;H01L31/18;H01L31/068;H01L31/02 主分类号 H01L21/00
代理机构 代理人
主权项 1. A method for manufacturing an interdigitated back contact solar cell, comprising steps of: (a) providing a doped silicon substrate, the substrate comprising a front, sunward facing, surface and a rear surface; (b) doping the rear surface of the substrate homogeneously with boron in a first pattern, thereby forming a p+ region on the rear surface of the silicon substrate, wherein the first pattern is a blanket pattern; (c) forming a silicon dioxide layer on the front surface and the rear surface; (d) depositing a phosphorus-containing doping paste on the rear surface in a second pattern, wherein the phosphorus-containing doping paste comprising a phosphorus compound and a solvent; (e) heating the silicon substrate in an ambient to a temperature and for a time period in order to locally diffuse phosphorus into the rear surface of the silicon substrate, thereby forming an n+ region on the rear surface of the silicon substrate through the second pattern, wherein the p+ region and the n+ region on the rear surface collectively form an interdigitated pattern; and (f) removing the silicon dioxide layer from the silicon substrate.
地址 Wilmington DE US