发明名称 3 DIMENSIONAL MODELING METHOD FOR OBJECT PRODUCTED THROUGH SEMICONDUCTOR MANUFACTURING PROCESS
摘要 A three dimensional virtual shape modeling method based on a semiconductor process is disclosed. According to the present invention, the modeling method three-dimensionally models a result which is generated by a process of deposition, etching, or the like such as a semiconductor or flat display panel manufacturing process. Especially, modeling is conveniently performed by using a two dimensional projection method when a layer, which is being etched after deposition, is formed on a previous layer, which is not flat.
申请公布号 KR101586765(B1) 申请公布日期 2016.01.25
申请号 KR20150028382 申请日期 2015.02.27
申请人 DAOUINCUBE, INC. 发明人 LIM, TAE HWA;KANG, DONG WAN;KIM, HYUN CHEOL
分类号 H01L21/66;H01L27/06 主分类号 H01L21/66
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