APPARATUS AND METHOD FOR TREATING A SUBSTRATE

摘要

The present invention relates to a substrate processing device. According to an embodiment of the present invention, the substrate processing device includes: a processing container including a processing space; a substrate support unit supporting a substrate in the processing space; and a spray unit supplying processing fluids to the substrate, supported by the substrate support unit. The spray unit includes: a fluid nozzle supplying the fluids; a first gas nozzle supplying first gas; a second gas nozzle supplying second gas; a nozzle support bar on which the fluid nozzle, the first gas nozzle, and the second gas nozzle are installed; a support shaft supporting the nozzle support bar; and an operator placed on the bottom of the support shaft to operate the support shaft. A distance between the fluid nozzle and the first gas nozzle is different from a distance between the fluid nozzle and the second gas nozzle.