| 摘要 |
The present invention relates to a membrane of a carrier head for a chemical mechanical polishing apparatus. The membrane comprises: a bottom plate which pressurizes a plate face of a wafer; a lateral face which is upwardly bent and formed from an edge of the bottom plate; a fixing flap which includes multiple vertical extension portions which are extended from the upper side and formed in a ring shape between the lateral face and the center of the bottom plate, and horizontal extension portions which are horizontally extended in a first direction from upper end portions of the vertical extension portions, respectively, and forms a plurality of pressure chambers between the bottom plate and a main body part of the carrier head as the horizontal extension portions are coupled to the main body part. Accordingly, since all the horizontal extension portions of the fixing flap are arranged in the same first direction, a deformation direction on the bottom face of each pressure chamber becomes regular, thereby minimizing the differences in the contraction and expansion of the bottom face according to the pressure chambers. Therefore, a pressurizing force applied to a wafer is not distorted due to a deformation state of the bottom face of each pressure chamber, and it is possible to accurately introduce the pressurizing force proportional to the pressure introduced to the pressure chamber, to the plate face of a wafer. |
