| 摘要 |
The present invention relates to a slurry supply device. The slurry supply device is installed around a chemical mechanical wafer polishing apparatus to supply a slurry to an upper side of the polishing pad, wherein the chemical mechanical wafer polishing apparatus comprises: a polishing pad; a polishing pad driving unit for rotating the polishing pad; a polishing head installed to face the polishing pad in an upper side of the polishing pad; and a polishing head driving unit for rotating the polishing head. |
