发明名称 |
SILVER ALLOY BONDING WIRE |
摘要 |
The present invention relates to a silver alloy bonding wire having silver as the main component. More specifically, provided is a silver alloy bonding wire containing palladium (Pd) of 1-4 wt pcnt , wherein the ratio of a mean grain size (a) of the outer portion to a mean grain size (b) of the center portion with respect to a cross section in the longitudinal direction of the bonding wire is in the range of 0.3-3. When utilizing the bonding wire of the present invention, bonding having excellent high ball formability and SOB bonding property can be obtained inexpensively. |
申请公布号 |
PH12015502149(A1) |
申请公布日期 |
2016.01.25 |
申请号 |
PH12015502149 |
申请日期 |
2015.09.15 |
申请人 |
MK ELECTRON CO., LTD. |
发明人 |
HONG, SUNG JAE;HEO, YOUNG IL;KIM, JAE SUN;LEE, JONG CHUL;MOON, JEONG TAK |
分类号 |
B23K35/18;B23K35/30 |
主分类号 |
B23K35/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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