COMPOSITIONS OF INK FOR FORMING EMBOSSED PATTERN AND METHOD FOR FORMING EMBOSSED PATTERN USING THE SAME

摘要

Provided is an ink composition with enhanced water and oil repellency so as to delete a clear residue elimination process of which an existing prior art (Japanese Patent Laid-open No. 2010-69684) has had. In addition, provided is a method for forming embossing patterns using the same. More specifically, provided is an ink composition which enhances implementation of embossing and comprises: (A) 10-40 wt% of a silane-modified polyacrylate resin; (B) 50-80 wt% of a silicone-modified polyacrylate resin; (C) 3-7 wt% of a silicone oil-type additive; and (D) 5-15 wt% of a silicone oil compound-type additive. Such ink composition has low surface tension, thereby exhibiting excellent water and oil repellency. In addition, clear paint is not attached on a printing surface printed with the ink composition, but is attached onto a non-printing surface instead, thereby forming the embossing patterns.