| 摘要 |
The invention relates to a method for treating a board (1) of wood material, such as an HDF board, an MDF board, a plywood board, planks or boarding, comprising the steps of providing a board (1) of wood material, arranging a composition (8) comprising a binder (9) on a first main face (2) of said board (1), arranging said board (1) on a draining surface (22), heat-treating said board (1) and the composition (8) arranged thereon, and pressing the composition (8) into said board (1). The invention also relates to a board element comprising one or more board layers, which board element comprises binder, the binder being heterogeneously distributed in at least one of said one or more board layers. |
