| 摘要 |
<p>The invention relates to a method for thermal simulation of an electronic circuit, including: a) the breaking down of the circuit into components, each represented as a first model including at least one meshing of the component, a matrix of heat conductances and a matrix of heat susceptances, b) the definition of at least one interface area of each model, c) the formation of a reduced model of each model, d) the connection of the reduced models of different components in order to form a reduced model of the circuit, e) the simulation of the thermal behavior of the circuit by means of this reduced model of the circuit.</p> |
