CURED PRODUCT OF PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION USED THEREFOR, METHOD FOR MANUFACTURING SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a cured product of a photosensitive resin composition, with which a shape of a fillet formed by using an underfill material can be controlled and a favorable fillet shape can be formed, and a method for manufacturing a substrate for mounting a semiconductor device and a method for manufacturing a semiconductor device using the above composition.SOLUTION: The cured product of a photosensitive resin composition is obtained by forming a photosensitive resin composition layer by using a photosensitive resin composition on a substrate, irradiating the photosensitive resin composition layer with active rays to cure, and subjecting the cured product to a surface treatment to obtain a surface roughness (arithmetic average roughness Ra) of 0.15 to 0.5 μm in a measurement range of 1 to 10 mm. The surface treatment is preferably a plasma treatment.