| 摘要 |
PROBLEM TO BE SOLVED: To provide a fiber structure formation device which enables easy molding of a fiber structure without use of a die.SOLUTION: Fiber structure forming devices 1, 2 and 3 include winding units 10, 50 and 60, tensile force application units 18, 55 and 64 which apply tensile force T to fiber bundles F1 and F2 running from the winding units 10, 50 and 60 toward a core material 100 and heating units 30, 70 and 80 which melt a thermoplastic resin adhered to the fiber bundles F1 and F2 within a specified heating region X where the tensile force T by the tensile force application units 18, 55 and 64 act on the fiber bundles F1 and F2. |
