发明名称 |
EXTERNAL MEMORY DEVICE |
摘要 |
An external memory device configured to communicate with an external electronic device includes: a semiconductor substrate including a first edge and a second edge perpendicular to the first edge; a semiconductor integrated circuit device provided on the semiconductor substrate, the semiconductor integrated circuit device including a memory device configured to store data provided from the external electronic device, an input/output interface configured to interface with the external electronic device, and a controller configured to control the memory device in response to a signal transmitted through the input/output interface; an insulating layer covering the semiconductor integrated circuit device; and external input/output pins provided adjacent to the first edge on the insulating layer and configured to establish an electrical connection between the external electronic device and the semiconductor integrated circuit device. |
申请公布号 |
US2016019967(A1) |
申请公布日期 |
2016.01.21 |
申请号 |
US201514802605 |
申请日期 |
2015.07.17 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG Myungryul;LEE Sung-ki;JANG Jongmin |
分类号 |
G11C16/10;G06F1/16;G06F12/02 |
主分类号 |
G11C16/10 |
代理机构 |
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代理人 |
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主权项 |
1. An external memory device configured to communicate with an external electronic device, the external memory device comprising:
a semiconductor substrate comprising a first edge and a second edge perpendicular to the first edge; a semiconductor integrated circuit device provided on the semiconductor substrate, the semiconductor integrated circuit device comprising a memory device configured to store data provided from the external electronic device, an input/output interface configured to interface with the external electronic device, and a controller configured to control the memory device in response to a signal transmitted through the input/output interface; an insulating layer covering the semiconductor integrated circuit device; and external input/output pins provided adjacent to the first edge on the insulating layer and configured to establish an electrical connection between the external electronic device and the semiconductor integrated circuit device. |
地址 |
Suwon-si KR |