THERMAL UNIFORMITY COMPENSATING METHOD AND APPARATUS

摘要

The invention provides a thermal uniformity compensating method and apparatus. The steps of the method includes: respectively measuring a plurality of first resistances of a plurality of hot spot patterns of a chip over an hot spot effect, wherein a plurality of pattern densities of the hot spot patterns are different; respectively measuring a plurality of second resistances of each of the hot spot patterns of the chip by a plurality of test keys over the hot spot effect, wherein a plurality of distances between the test keys and the corresponding hot spot pattern are different; establishing a look-up information according to the first and second resistances; analyzing a layout data of the chip for obtaining a pattern density information; and generating a calibrated layout data according to the pattern density information and the look-up information.

主权项

1. A thermal uniformity compensating method for a chip, comprising:
disposing a plurality of hot spot patterns and test keys in the chip on a semiconductor wafer; respectively measuring a plurality of first resistances of the hot spot patterns of the chip by the test keys over a hot spot effect, wherein a plurality of pattern densities of the hot spot patterns are different; respectively measuring a plurality of second resistances of each of the hot spot patterns of the chip by the test keys over the hot spot effect, wherein a plurality of distances between the test keys and the corresponding hot spot pattern are different; establishing a look-up information according to the first and second resistances, wherein the look-up information is established based on the pattern densities and the distances, and used for looking-up to obtain a plurality of resistance variations; analyzing a layout data of the chip for obtaining a pattern density information; and generating a calibrated layout data according to the pattern density information and the look-up information.