APPARATUS FOR ADSORBING SOLDER BALL AND METHOD OF ATTACHING SOLDER BALL USING THE SAME

摘要

Provided are an apparatus of adsorbing solder balls and a method of attaching the solder balls using the same. The solder ball adsorbing apparatus includes a body, a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded, and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom. The eject pins include a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body, a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface, and a third eject pin disposed between the first and second eject pins.

主权项

1. An apparatus for adsorbing solder balls, comprising:
a body; a plurality of eject pins disposed in the body and configured to move in downward and upward directions with respect to a substrate on which the solder balls are to be loaded; and a solder ball holder disposed in the body and configured to hold the solder balls at the eject pins and release the solder balls therefrom, wherein the eject pins comprise: a first eject pin disposed at a center of the body in parallel with a vertical surface that is perpendicular to a bottom surface of the body; and a second eject pin disposed at an edge of the body at a first angle with respect to the vertical surface.