| 摘要 |
PROBLEM TO BE SOLVED: To provide a base plate for power module with heat sink and a power module requiring no special stress relaxation layer interposed superior in stress relaxation performance with a simple structure.SOLUTION: A base plate for power module with heat sink 1 having metal layers 12 and 13 joined onto the surfaces of a ceramic substrate 11 respectively, and the metal layer 13 has a heat sink 20 bonded thereon. The heat sink 20 has plural pin-fins 22 are vertically formed on one surface of a plate-like part 21, and on the other face of the plate-like part 21, plural concavities 23 are formed. The other plane of the plate-like part 21 is bonded to the metal layer 13 and plural cavities 5 are formed by the concavities 23 between the plate-like part 21 and the metal layer 13. |
