| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing method of a circuit board by which, even in the case where a circuit board processing step of applying heating and pressing processing is implemented, a sufficient adhesion strength is maintained during the heating and pressing processing and after the end of the circuit board processing step, a support plate can be exfoliated from the circuit board without damaging the circuit board or without adhesive residue.SOLUTION: At least in the order of steps, the processing method includes: a support plate fixing step of fixing a circuit board 11 to a support plate 2 via a curable adhesive composition 3 containing a curable adhesive component which is cross-linked and cured by stimuli; an adhesive curing step of cross-linking and curing the curable adhesive component by stimulating the curable adhesive composition; a circuit board processing step of applying the heating and pressing processing to the circuit board fixed to the support plate; and a support plate exfoliation step of exfoliating the support plate from the circuit board after the processing. |
