| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can prevent peeling of an encapsulation resin from a lead in temperature cycling test.SOLUTION: A semiconductor device SD comprises: a semiconductor chip CH; signal leads SL which are arranged around the semiconductor chip CH and each of which has a principal surface and a rear face opposite to the principal surface; wires BW for electrically connecting the semiconductor chip CH and the principal surfaces of the signal leads; and an encapsulation body BD composed of an encapsulation resin for encapsulating the semiconductor chip CH, the signal leads SL and the wires BW. The signal lead SL has in an extension direction of the signal lead SL: one end located in the encapsulation body BD; another end located outside the encapsulation body BD; a wire connection region BC which is the principal surface of the signal lead SL and to which the wire BW is connected; and an inner groove GV1 formed on the principal surface of the signal lead SL between the one end and the wire connection region BC. |
