| 摘要 |
PROBLEM TO BE SOLVED: To provide: a multilayer printed wiring board which never worsens the reliability of connection while preventing the transmission delay of high-frequency signals; and a method for manufacturing such a multilayer printed wiring board.SOLUTION: A method for manufacturing a multilayer printed wiring board comprises the steps of: forming via-holes in an insulator layer on an insulative substrate; forming a first metal coat on the surface of the insulator layer and in the via-holes; forming a resist coat on the first metal coating; exposing the first resist coat to light, followed by development; forming a second metal coat on the first metal coat exposed after the development of first resist coat; removing the first resist coat; removing the first metal coat exposed after removal of the first resist coat; forming a second resist coat, on the second metal coating, at a place where an opening of a solder resist is formed; forming a third metal coat on a part of the second metal coat, which is not covered by the second resist coat; forming an anti-corrosion coat on the third coat; removing the second resist coat; forming a solder resist coat on the second metal coat and the third metal coat; and partially removing the solder resist coat, thereby forming the solder resist opening. |
