| 发明名称 |
APPARATUS AND METHOD FOR REDUCING SUBSTRATE SLIDING IN PROCESS CHAMBERS |
| 摘要 |
Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface. |
| 申请公布号 |
US2016020134(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514752245 |
申请日期 |
2015.06.26 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
THIRUNAVUKARASU SRISKANTHARAJAH;SAVANDAIAH KIRANKUMAR;TSAI CHENG-HSIUNG;LIEW KAI LIANG |
| 分类号 |
H01L21/687;H01L21/02;C23C14/50;C23C16/50;C23C16/455;C23C16/458;H01L21/306;H01J37/32 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for processing a substrate, comprising:
a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface. |
| 地址 |
Santa Clara CA US |
