SUBSTRATE CUTTING APPARATUS

摘要

A substrate cutting apparatus comprises: a first alignment unit for aligning a mother panel including a plurality of unit panels which have a long side in a first direction, and a short side in a second direction perpendicularly crossing the first direction; first and second cutting units for cutting the aligned mother panel along first cutting lines extending along the long side of the unit panels so as to form stick panels including the unit panels; and third and fourth cutting units for cutting the stick panels along a second cutting line corresponding to a line of the short side of the unit panels so as to form the unit panels. The first to fourth cutting lines individually emit a laser beam to the mother panel and the stick panels to form a scribing line along the first and second cutting lines, and a predetermined pressure is applied to the scribing line so as to cut the mother panel and the stick panels along the scribing line.