| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device comprises: a probe region PBR of a pad PD covered with a protective insulation film PIF, where a probe mark PM is formed; and a pillar electrode PE which has a first part formed in an opening region OP2 and a second part which extends from above the opening region OP2 to above the probe region PBR, in which a position of center of the opening region OP2 deviates from a position of center of the pillar electrode PE opposite to a bonding finger. |
