| 发明名称 |
MULTI-STACKED ELECTRONIC DEVICE WITH DEFECT-FREE SOLDER CONNECTION |
| 摘要 |
A method includes forming a multi-stacked electronic device having two or more electronic components, each of the electronic components includes a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, and the joint is located outside a solder connection region. |
| 申请公布号 |
US2016021750(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201414332776 |
申请日期 |
2014.07.16 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Ang Ai Kiar;Lauri Michael |
| 分类号 |
H05K1/18;H05K3/34;H05K3/32 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
forming a multi-stacked electronic device having two or more electronic components, each of the electronic components comprises a leadframe, the leadframes of each electronic component are physically joined together using a non-solder metal joining process to form a joint, wherein the joint is located outside a solder connection region. |
| 地址 |
Armonk NY US |
