发明名称 RESIN SUBSTRATE AND MANUFACTURING METHOD OF RESIN SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a resin substrate and a manufacturing method of the resin substrate which can prevent deformation due to a creep and maintain reliability of a connection with a terminal.SOLUTION: A resin substrate 10 has a core base material 11 and build-up layers 12 in which wirings 13, 13a, 13b are formed, and a terminal 200 which is electrically connected to the wirings 13, 13a, 13b by being pressed at a first terminal 210 and a second terminal 220. In the core base material 11 and the build-up layers 12, vias 14 and an interstitial via hole (IVH) 15 are formed between a contact part which is in contact with the first terminal 210 in the first wiring 13a and a contact part which is in contact with the second terminal 220 in the second wiring 13b.
申请公布号 JP2016012668(A) 申请公布日期 2016.01.21
申请号 JP20140133760 申请日期 2014.06.30
申请人 DENSO CORP 发明人 YOSHIKAWA SHOTA;NUMAZAKI KOJI
分类号 H05K1/11;H05K1/14;H05K3/40 主分类号 H05K1/11
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