| 摘要 |
An optoelectronic component includes a carrier substrate, a single optoelectronic semiconductor chip arranged on the carrier substrate, an emission surface that emits light radiation which is part of a front side of the optoelectronic component, and a reflective layer adjacent to the emission surface at the front side of the optoelectronic component, wherein the emission surface is arranged such that the emission surface forms a part of an edge of the front side of the optoelectronic component. |
