BENDABLE CARRIER MOUNT, DEVICE AND METHOD FOR RELEASING A CARRIER SUBSTRATE

摘要

A flexible carrier mount for mounting of a carrier substrate when the carrier substrate is detached from a product substrate, detachment means being provided for debonding the product substrate with bending of the carrier substrate. A device for detaching a carrier substrate from one product substrate in one detachment direction having: a carrier mount flexible in the detachment direction for mounting the carrier substrate, a substrate mount for mounting the product substrate, and detachment means for debonding the carrier substrate from the product substrate with bending of the carrier substrate. A method for detaching a carrier substrate from a product substrate in one detachment direction with the steps: mounting the product substrate with a substrate mount and mounting the carrier substrate with a carrier mount flexible in the detachment direction and debonding the carrier substrate from the product substrate with bending of the carrier substrate.

主权项

1. A system for debonding a product substrate from a carrier substrate, wherein the product substrate is temporarily connected to the carrier substrate by an interconnect layer to form a stack, the system comprising:
means for supporting the stack; separating means for initiating separation of the product substrate from the carrier substrate, the separating means having a tip that penetrates into the interconnect layer of the stack from a peripheral edge of the interconnect layer; a first member having a surface extending in a plane generally parallel to a plane of a surface of the carrier substrate; and an extension portion extending from the first member, wherein the extension portion includes a surface configured to contact a peripheral edge of the carrier substrate, wherein the system applies a force to the carrier substrate to bend the carrier substrate away from the product substrate and thereby debond the product substrate from the carrier substrate.