THIN FILM DEPOSITION APPARATUS AND METHOD

摘要

The present invention relates to a thin film deposition apparatus comprising: a substrate loading unit on which a substrate is loaded; a substrate carrying unit coupled to the substrate loading unit to alternately move the substrate; and a thin film deposition unit for depositing a thin film on the substrate. Here, the thin film deposition unit comprises: a plurality of plasma modules; and an isolation part for connecting or blocking spaces under plasma generation modules adjacent to each other by being arranged between the plasma modules or through a descending operation, wherein the substrate carrying unit alternately moves the substrate loading unit, thereby depositing a thin film on the substrate.