A component mounting device is equipped with a heater unit (35) for heating a partial region of a substrate (S) by a heater (39), said partial region being a region narrower than the moving range of a head (60). A region heated by the heater (39) is set to a mounting region and the head (60) is controlled to mount components on the substrate (S). Every time the mounting of the components required in the mounting region is completed, the mounting region is shifted by moving the substrate (S) so that an unmounted region where no components are mounted on the substrate (S) is set to a mounting region, and components are mounted on the new mounting region.
