发明名称 FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, and a pair of ground layers and, includes a pleated part PL having a plurality of curved portions which are curved so as to be opened or closed, in which in the ground layers, mesh ground layers in which conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, in which the mesh ground layers are arranged on an outer peripheral side of the curved portions PL2, and the solid ground layers are arranged on an inner peripheral side of the curved portions.
申请公布号 US2016020500(A1) 申请公布日期 2016.01.21
申请号 US201514870687 申请日期 2015.09.30
申请人 NIPPON MEKTRON, LTD. 发明人 MATSUDA Fumihiko
分类号 H01P3/08;H05K1/02;H05K3/00;H05K3/42;H01P11/00;H05K1/11 主分类号 H01P3/08
代理机构 代理人
主权项 1. A flexible printed circuit board having at least a set of strip line transmission path by being provided with a signal line, insulating layers covering the signal line from both sides and each made of a thermoplastic resin as its material, and a pair of ground layers facing the signal line with the respective insulating layers sandwiched therebetween, the flexible printed circuit board comprising a pleated part having curved portions molded at a plurality of positions thereof, the curved portions being curved so as to be opened or closed, in the ground layers, mesh ground layers in which conductive portions exist to surround openings so that the conductive portions are provided in a mesh shape, and solid ground layers in which the conductive portions are provided in a planar state, are provided, the mesh ground layers are arranged on an outer peripheral side of the curved portions, and the solid ground layers are arranged on an inner peripheral side of the curved portions.
地址 Tokyo JP