| 发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
The semiconductor package according to an exemplary embodiment includes: a substrate having a plurality of circuit layers and connection pads which are provided between a plurality of insulating layers; a plated tail part of which one end is electrically connected to the connection pad; a dicing part provided in contact with the other end of the plated tail part; a molded part provided on the substrate; and molded part vias provided on the connection pads and penetrating through the molded part. |
| 申请公布号 |
US2016020171(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514798833 |
申请日期 |
2015.07.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LIM Jae Hyun;YOO Do Jae;JO Eun Jung |
| 分类号 |
H01L23/522;H01L23/48;H01L21/56;H01L21/288;H01L21/66;H01L21/78;H01L23/00;H01L23/31;H01L21/768 |
主分类号 |
H01L23/522 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a substrate having a plurality of circuit layers and connection pads which are provided between a plurality of insulating layers; a plated tail part of which one end is electrically connected to the connection pad; a dicing part provided in contact with the other end of the plated tail part; a molded part provided on the substrate; and molded part vias provided on the connection pads and penetrating through the molded part. |
| 地址 |
Suwon-si KR |
