SUPERPOSED STRUCTURE 3D ORTHOGONAL THROUGH SUBSTRATE INDUCTOR

摘要

A three-dimensional (3D) orthogonal inductor pair is embedded in and supported by a substrate, and has a first inductor having a first coil that winds around a first winding axis and a second inductor having a second coil that winds around a second winding axis. The second winding axis is orthogonal to the first winding axis. The second winding axis intersects the first winding axis at an intersection point that is within the substrate.

主权项

1. A three-dimensional (3D) orthogonal inductor pair, comprising:
a substrate, wherein the substrate has a substrate top surface and a substrate bottom surface; a first inductor, wherein the first inductor is supported by the substrate, wherein the first inductor includes a first coil winding, and wherein the first coil winding is arranged to wind around a winding section of a first winding axis; and a second inductor, wherein the second inductor is supported by the substrate, wherein the second inductor includes a second coil winding, wherein the second coil winding is arranged to wind around a winding section of a second winding axis, wherein the second winding axis is orthogonal to the first winding axis, and wherein the second winding axis intersects the first winding axis at an intersection point, wherein the intersection point is within the winding section of the first winding axis and is within the winding section of the second winding axis.