METHOD OF FORMING ADHESIVE CONNECTIONS

摘要

The present disclosure relates to a composite assembly comprising an optically transparent substrate. The present disclosure is also directed to a method of forming an adhesive connection between an optically transparent substrate and a second substrate.

主权项

1. A method of forming an adhesive connection between a first optically transparent substrate and a second substrate, the method comprising the steps of:
a) providing a connecting device suitable for connecting said first optically transparent substrate and a second substrate and comprising at least one first connector comprising a contact portion suitable to form an adhesive connection with the first optically transparent substrate, wherein the surface of the contact portion is provided with at least one recess; b) applying an adhesive composition onto at least part of the surface of the contact portion thereby substantially filling the recess; c) contacting the contact portion provided with the adhesive composition with the first optically transparent substrate.