| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit body of a novel structure capable of stably performing power supply to an electronic component mounted on a printed board without depending on performance of a conducting path of the printed board and capable of displaying excellent heat dissipation, and to provide an excellent manufacturing method of the electronic circuit body.SOLUTION: An electronic circuit body 10 is configured by mounting an electronic component 14 on a printed board 12. A power supply side conducting path 26 and a branch side conducting path 28 are exposed to a surface 16 of the printed board 12, a power supply side terminal 36 and a branch side terminal 34 of the electronic component 14 are respectively connected to the power supply side conducting path 26 and the branch side conducting path 28 by soldering, a bus bar 18 is placed on the surface 16 of the printed board 12 through an insulation layer 20, and the power supply side terminal 36 of the electronic component 14 is directed connected to the bus bar 18 by soldering. |
