发明名称 ENERGY SENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide an energy sensitive resin composition, even in the case a polybenzoxazole precursor is heat-treated at a low temperature, giving a polybenzoxazole resin excellent in mechanical properties such as tensile elongation and chemical resistance, suppressed in coloring and high in transparency, a method for producing a polybenzoxazole a film or a polybenzoxazole molded body using the energy sensitive resin composition, and a pattern production method using the energy sensitive resin composition.SOLUTION: Provided is an energy sensitive resin composition comprising a polybenzoxazole precursor obtained by reacting aromatic diamine diol and a diformyl compound or dicarboxylic acid dihalide, a solvent and a compound (A) decomposed by the action of at least either light or heat to generate at least either a base or acid.
申请公布号 JP2016012019(A) 申请公布日期 2016.01.21
申请号 JP20140133088 申请日期 2014.06.27
申请人 TOKYO OHKA KOGYO CO LTD 发明人 NODA KUNIHIRO;CHISAKA HIROKI;SHIODA MASARU
分类号 G03F7/038;C08G73/22;G03F7/004;G03F7/037;G03F7/40 主分类号 G03F7/038
代理机构 代理人
主权项
地址