发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has high-breakdown-voltage insulation properties and is excellent in heat resistance and storage stability.SOLUTION: The thermosetting resin composition contains (A) a cyanate ester compound having two or more cyanato groups in one molecule, (B) a phenol curing agent containing a resorcinol type phenol resin, and (C) at least one compound selected from a tetraphenylborate salt of a tetrasubstituted phosphonium compound and a tetraphenylborate salt represented by formula (2). (Ris selected from a hydrogen atom, a 1-6C alkyl group, and a phenyl group, and n is an integer of 1-3.)
申请公布号 JP2016011410(A) 申请公布日期 2016.01.21
申请号 JP20150041093 申请日期 2015.03.03
申请人 SHIN ETSU CHEM CO LTD 发明人 KUSHIHARA NAOYUKI;SUMIDA KAZUMASA
分类号 C08G73/00 主分类号 C08G73/00
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