| 发明名称 |
METHOD FOR FABRICATING PACKAGE STRUCTURE |
| 摘要 |
A method for fabricating a package structure is provided. At least one light emitting component is sucked and adhered to a carrier. An encapsulating member encapsulates the light emitting component. A conductive component is connected to the light emitting component. |
| 申请公布号 |
US2016020367(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514798720 |
申请日期 |
2015.07.14 |
| 申请人 |
ACHROLUX INC. |
发明人 |
Ling Peiching;Liu Dezhong |
| 分类号 |
H01L33/54;H01L33/44;H01L33/50;H01L33/62;H01L33/00 |
主分类号 |
H01L33/54 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating a package structure, comprising:
sucking and adhering at least one light emitting component to a carrier; forming a plurality of conductive parts on the carrier; forming on the carrier an encapsulating member that encapsulates the light emitting component and the conductive parts, and has a first surface, from which the light emitting component and the conductive parts are exposed, and a second surface opposing the first surface; and removing the carrier. |
| 地址 |
Sunnyvale CA US |
