发明名称 METHOD FOR FABRICATING CMOS IMAGE SENSORS AND SURFACE TREATING PROCESS THEREOF
摘要 The present invention provides a method for fabricating a CMOS image sensor including a plurality of steps. Firstly, a substrate is provided. Then, a pixel region covering most of the substrate and a logic circuit region on a periphery of the substrate are formed. After that, at least one trench is formed in the pixel region. Next, a deposition process is performed to fill the at least one trench and cover the pixel region. Then, a planarization process is performed to expose a surface of the pixel region. A first treatment on the exposed surface of the pixel region is next performed by applying a first cleaning solution including hydrogen fluoride (HF) and ethylene glycol (EG). Besides, an amount of HF is lesser than that of EG.
申请公布号 US2016020246(A1) 申请公布日期 2016.01.21
申请号 US201414332346 申请日期 2014.07.15
申请人 UNITED MICROELECTRONICS CORPORATION 发明人 WANG Shou-Guo;Neo Boon-Tiong;Fang Han-Chuan
分类号 H01L27/146;H01L21/306;H01L21/02;H01L21/762 主分类号 H01L27/146
代理机构 代理人
主权项 1. A method for fabricating a CMOS image sensor, comprising steps of: providing a substrate; defining a pixel region covering most of said substrate and defining a logic circuit region on a periphery of said substrate; forming at least one trench in said pixel region; performing a deposition process to fill said at least one trench and cover said pixel region; performing a planarization process to expose a surface of said pixel region; and performing a first treatment on said exposed surface of said pixel region by applying a first cleaning solution comprising hydrogen fluoride (HF) and ethylene glycol (EG), wherein an amount of HF is lesser than that of EG.
地址 Hsinchu TW