发明名称 |
METHOD FOR FABRICATING CMOS IMAGE SENSORS AND SURFACE TREATING PROCESS THEREOF |
摘要 |
The present invention provides a method for fabricating a CMOS image sensor including a plurality of steps. Firstly, a substrate is provided. Then, a pixel region covering most of the substrate and a logic circuit region on a periphery of the substrate are formed. After that, at least one trench is formed in the pixel region. Next, a deposition process is performed to fill the at least one trench and cover the pixel region. Then, a planarization process is performed to expose a surface of the pixel region. A first treatment on the exposed surface of the pixel region is next performed by applying a first cleaning solution including hydrogen fluoride (HF) and ethylene glycol (EG). Besides, an amount of HF is lesser than that of EG. |
申请公布号 |
US2016020246(A1) |
申请公布日期 |
2016.01.21 |
申请号 |
US201414332346 |
申请日期 |
2014.07.15 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
WANG Shou-Guo;Neo Boon-Tiong;Fang Han-Chuan |
分类号 |
H01L27/146;H01L21/306;H01L21/02;H01L21/762 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
1. A method for fabricating a CMOS image sensor, comprising steps of:
providing a substrate; defining a pixel region covering most of said substrate and defining a logic circuit region on a periphery of said substrate; forming at least one trench in said pixel region; performing a deposition process to fill said at least one trench and cover said pixel region; performing a planarization process to expose a surface of said pixel region; and performing a first treatment on said exposed surface of said pixel region by applying a first cleaning solution comprising hydrogen fluoride (HF) and ethylene glycol (EG), wherein an amount of HF is lesser than that of EG. |
地址 |
Hsinchu TW |