IMAGING DEVICE, INSPECTION APPARATUS, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

摘要

The imaging device includes a sensor substrate, a light-blocking substrate, a light-collecting substrate, a sealing material, and a light-transmitting member. The light-transmitting member includes a light-transmitting base disposed to be in contact with either the sensor substrate or the light-blocking substrate, and a light-transmitting resin which is filled between the base and the sensor substrate or the light-blocking substrate. A void is formed in at least a part of a space between the sealing material and the light-transmitting member.

主权项

1. A method of manufacturing an electronic device having a pair of substrates disposed to be opposite to each other at a predetermined gap, the method comprising:
forming a base on one substrate of the pair of substrates; coating the periphery of the base with an adhesive including a gap material forming the predetermined gap; coating the surface of the base with a light transmitting resin material; disposing the pair of substrates at a predetermined gap by bringing the other substrate of the pair of substrates in contact with the light transmitting resin material to be superposed on the one substrate; and solidifying the adhesive.