发明名称 POWER MOSFET HAVING TRENCH GATE AND MANUFACTURING METHOD THEREFOR
摘要 A power MOSFET having a trench gate, of the present invention, comprises: an N+ substrate; an N- epitaxial layer formed on the N+ substrate; a P- body layer including a P+ body formed on the N- epitaxial layer; an N+ source area formed within a part of the P- body layer; a trench penetrating the N+ source area and the P- body layer so as to reach the N- epitaxial layer; a gate insulation film and a gate electrode formed within the trench; a source electrode connected to the N+ source area; and an insulation film formed on the gate electrode so as to separate the gate electrode and the source electrode, wherein the trench has a curvature diameter of a predetermined value or more at a corner part meeting the N+ source area and a corner part of a bottom of the trench.
申请公布号 WO2016010197(A1) 申请公布日期 2016.01.21
申请号 WO2014KR10089 申请日期 2014.10.24
申请人 KIM, JANG RAE 发明人 KIM, JANG RAE;CHOE, YEONG SEOK
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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