SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To improve reliability of a semiconductor device.SOLUTION: A semiconductor device of one embodiment comprises an element separation region STI which extends in an X direction and has a cross region R1 crossing a memory gate electrode MG which extends in a Y direction orthogonal to the X direction in plan view. Here, in the cross region R1, a width ES1 in the Y direction of one end edge located on a source region SR side is larger than a width ES2 in the Y direction of the other end edge located on a control gate electrode side.