PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on the first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer and protruding from the second surface of the insulation layer, a via penetrating through the insulation layer and electrically connecting the first and second conductive layers, a solder-resist layer covering the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer, and a metal layer formed on the exposed structure and protruding from the first surface of the insulation layer. The exposed structure of the first conductive layer includes pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface.

主权项

1. A printed wiring board, comprising:
a resin insulation layer; a first conductive layer formed on a first-surface side of the resin insulation layer such that the first conductive layer is embedded into a first surface of the resin insulation layer and has a surface exposed on the first surface of the resin insulation layer; a second conductive layer formed on a second-surface side of the resin insulation layer such that the second conductive layer is formed on a second surface of the resin insulation layer and is protruding from the second surface of the resin insulation layer; a via conductor formed in the resin insulation layer such that the via conductor is penetrating through the resin insulation layer and electrically connecting the first conductive layer and the second conductive layer; a solder-resist layer formed on the first surface of the resin insulation layer such that the solder-resist layer is covering the first conductive layer and has an opening structure forming an exposed structure of the first conductive layer; and a metal layer formed on the exposed structure of the first conductive layer such that the metal layer is protruding from the first surface of the resin insulation layer, wherein the exposed structure of the first conductive layer comprises a plurality of pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface.