| 发明名称 |
THIN FILM WITH MULTILAYER DIELECTRIC COATINGS FOR LIGHT EMITTING DIODE (LED) LEAD FRAME AND CHIP-ON-BOARD (COB) SUBSTRATE REFLECTOR |
| 摘要 |
A light emitting diode (LED) package according to various embodiments can include a metal substrate having a surface roughness. A thin film coated reflector is applied to the metal substrate. At least one light emitting diode (LED) chip is mounted above at least a portion of the metal substrate. |
| 申请公布号 |
US2016020370(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201414336532 |
申请日期 |
2014.07.21 |
| 申请人 |
GE Lighting Solutions, LLC |
发明人 |
Cai Dengke;Jacob Cherian;Mayer Mark J.;Saha Koushik;Lou Xiaomei;Smith Gabriel Michael;Ward Benjamin James |
| 分类号 |
H01L33/60;H01L33/22;H01L33/62 |
主分类号 |
H01L33/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) package, comprising:
a metal substrate; a multilayer reflector disposed on at least a portion of the metal substrate, the multilayer reflector comprising at least two different metal oxide dielectric layers with different refractive index; and at least one light emitting diode (LED) chip mounted above at least a portion of the metal substrate. |
| 地址 |
East Cleveland OH US |
