发明名称 HEAT-RAY-SHIELDING MICROPARTICLES, HEAT-RAY-SHIELDING MICROPARTICLE LIQUID DISPERSION, HEAT-RAY-SHIELDING FILM, HEAT-RAY-SHIELDING GLASS, HEAT-RAY-SHIELDING DISPERSION, AND HEAT-RAY-SHIELDING LAMINATED TRANSPARENT SUBSTRATE
摘要 Provided are: heat-ray-shielding microparticles for enabling use of a communication device, imaging device, sensor, or the like which uses near-infrared light in a corresponding wavelength region through a structure, a heat-ray-shielding film or heat-ray-shielding glass, a dispersion, or a laminated transparent substrate, while exhibiting heat-ray-shielding characteristics; a heat-ray-shielding microparticle liquid dispersion containing the heat-ray-shielding microparticles; a heat-ray-shielding film or heat-ray-shielding glass; a heat-ray-shielding dispersion; and a heat-ray-shielding laminated transparent substrate. Provided are: composite tungsten oxide microparticles having a hexagonal crystal structure represented by the general formula AaMbWcOd, element A being one or more species of elements selected from Mo, Ru, Cr, Ni, V, Co, Fe, Mn, Ti, Ge, Sn, Ga, Pb, Bi, In, Sb, Pd, and Tl, M being one or more species of elements selected from alkali metals and alkaline earth metals, W being tungsten, O being oxygen, 0.001 ≤ a/b ≤ 0.1, and 0.20 ≤ b/(a + c) ≤ 0.61, and 2.2 ≤ d/(a + c) ≤ 3.0; and a heat-ray-shielding microparticle liquid dispersion which uses the heat-ray-shielding microparticles.
申请公布号 WO2016010156(A1) 申请公布日期 2016.01.21
申请号 WO2015JP70626 申请日期 2015.07.17
申请人 SUMITOMO METAL MINING CO., LTD. 发明人 MACHIDA KEISUKE;ADACHI KENJI
分类号 C09K3/00;C01G41/00;C01G45/00;C01G49/00;C01G51/00;C01G53/00;C01G55/00;C09C1/00;C09C3/04;C09D17/00 主分类号 C09K3/00
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