SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which is excellent in connection reliability between a main electrode and a control electrode which are provided on a principal surface of a semiconductor element with connection wiring such as a bonding wire, and which can improve connection workability of the control electrode with the connection wiring.SOLUTION: A semiconductor device has a composition in which a control electrode 4 and a main electrode 3 which are provided on a principal surface of a semiconductor element 1 are electrically connected with a wire or ribbon-like connection wiring 7, 9 via conductive member. The conductive member is divided into a control electrode conductive member 6 joined to the control electrode 4 and a main electrode conductive member 5 joined to the main electrode 3 and the control electrode conductive member 6 and the main electrode conductive member 5 are fastened by an insulating material 13. The control electrode conductive member 6 has a surface which is connected with the control electrode 4 and larger in area than a surface connected with the connection wiring 7.