| 摘要 |
PROBLEM TO BE SOLVED: To prevent a short-circuiting defect in a connection part of a printed wiring board and a connection part with an electrode pad of an electronic component, the short-circuiting defect being apprehended particularly in the case where the electrode pad of the electronic component is concentrated around in a narrow pitch.SOLUTION: On a first face of a resin insulation layer, a first conductor layer including a wiring pattern including a plurality of wires 12a is embedded so as to expose its surface. A solder resist layer 16 is provided on the surface and a connection part 12b of the wires 12a is exposed. The electrode pad of the electronic component is soldered to the connection part 12b. The connection part 12b is provided in one line or in a zigzag shape in a direction across an extension direction of the wires 12a and can also be soldered without the risk of contact even to an electronic component of a narrow pitch where the electrode pad is formed in a concentrated manner around an electronic component 20. |
