发明名称 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
摘要 Solid-state imaging devices, methods of producing a solid-state imaging device, and electronic apparatuses are provided. More particularly, a solid-state image device (1) includes a silicon substrate (22), and at least a first photodiode (33) formed in the silicon substrate. The device also includes an epitaxial layer (21) with a first surface adjacent a surface of the silicon substrate, and a transfer transistor (31) with a gate electrode (41) that extends from the at least a first photodiode to a second surface of the epitaxial layer opposite the first surface. In further embodiments, a solid-state imaging device with a plurality of pixels formed in a second semiconductor substrate wherein the pixels are symmetrical with respect to a center point is provided. A floating diffusion is formed in an epitaxial layer, and a plurality of transfer gate electrodes that are each electrically connected to the floating diffusion by one of the transfer gate electrodes is provided.
申请公布号 US2016020236(A1) 申请公布日期 2016.01.21
申请号 US201414772196 申请日期 2014.03.03
申请人 SONY CORPORATION 发明人 TANAKA Yosuke;WAKANO Toshifumi;TATANI Keiji;NAGANO Takashi;IWAMOTO Hayato;NAKAZAWA Keiichi;HIRANO Tomoyuki;YAMAGUCHI Shinpei;MARUYAMA Shunsuke
分类号 H01L27/146 主分类号 H01L27/146
代理机构 代理人
主权项 1. A solid-state imaging device, comprising: a silicon substrate; at least a first photodiode, wherein the first photodiode is formed in the silicon substrate; an epitaxial layer, wherein a first surface of the epitaxial layer is adjacent a surface of the silicon substrate; a transfer transistor, wherein a gate electrode of the transfer transistor extends from the at least a first photodiode to a second surface of the epitaxial layer opposite the first surface.
地址 Minato-ku, Tokyo JP