NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, AND RESIN CURED FILM, PARTITION AND OPTICAL ELEMENT

摘要

Provided are: a negative-type photosensitive resin composition for use in the manufacture of an optical element or the like (organic EL element, quantum dot display, TFT array, thin film solar cell) having an upper surface of a partition with good ink repellency and enabling the reduction of residues at an opening; a resin cured film for an optical element having good ink repellency on an upper surface; a partition for an optical element enabling the formation of a fine and highly accurate pattern; and the aforementioned optical element having the partition. The negative type photosensitive resin composition is characterized by comprising a photocurable alkali-soluble resin or alkali-soluble monomer, a photopolymerization initiator, an acid generating agent, an acid curing agent, and an ink repelling agent. The cured film and a partition are formed using the negative type photosensitive resin composition, and the aforementioned optical element has a plurality of dots on a substrate surface and the partition positioned between adjacent dots.